连线式FOG邦定机系列_邦定机系列_产品展示_中国电子科技集团公司第二研究所_原材料及设备厂商

连线式FOG邦定机系列

连线式FOG邦定机系列 In-line FOG bonding machine

用于将TP或FPC与ITO玻璃之间建立稳定的机械和电气连接的生产设备。其主要完成功能有：自动上料、定位、ACF预贴、对位（人工）、预压、主压、自动下料。

减少手动FOG工序操作人员，减少设备占地面积，操作员不用接触玻璃。

The machine is used to make stable mechanical and electrical connection between TP and ITO or TP and ITO. The main functions are: automatic supply, positioning, alignment (manually), pre-pressing, main pressing and automatic displacement.

The advantages of the machine: fewer operators for FOG procedure, less area for the equipment, operators needn’t touch the glass, realizing the unattended operation.

Applications: LCM（connecting with COG）、OGS、single/double Film、Glass Sensor.

设备型号Type	ZBD-80C	ZBD-120C
基板尺寸Panel size	2020 mm ～ 7585 mm 压接边为75mm Pressure line 75mm	2020 mm ～ 120120 mm 压接边为120mm Pressure line 120mm
FPC尺寸 FPC size	165.15 mm ～ 5050 mm	1010 mm ～ 8080 mm
设备整机节拍 The whole working pace	4 S/片（主压时间按12S计） 4s/piece (main pressing time is 12s)	6 S/片（主压时间按8S计） 6s/piece (main pressing time is 8s)
下偏光片厚度 Low polarizer thickness	0 ～ 1.0mm	0 ～ 1.0mm
ACF尺寸 ACF size	宽：1 ～ 6 mm Width: 1 ～ 6 mm 层数：2层 Layers: 2 盘径：外径150 mm Plate diameter: external diameter 150mm	宽：1 ～ 6 mm Width: 1 ～ 6 mm 层数：2层 Layers: 2 盘径：外径150 mm Plate diameter: external diameter 150mm
温度设定范围 Available temp	室温～350℃ Room temp ～350℃	室温～350℃ Room temp ～350℃
ACF预贴精度 ACF pre-attaching accuracy	±0.15mm（X,Y方向）以基板外型为基准 ±15μm（X,Y direction） Take the substrate shape as the reference	±0.15mm（X,Y方向）以基板外型为基准 ±15μm（X,Y direction） Take the substrate shape as the reference
FPC压接精度 FPC crimping accuracy	X、Y：± 10μm（3σ）从预压到最终压接的偏移量 Offset from pre-pressing to final crimping	X、Y：± 10μm（3σ）从预压到最终压接的偏移量 Offset from pre-pressing to final crimping
对位方式 Alignment method	CCD放大图像辅助观察，手动对位 CCD enlarging image as auxiliary observation, manual alignment	CCD放大图像辅助观察，手动对位 CCD enlarging image as auxiliary observation, manual alignment

可根据客户要求订制 The machine can be made according to the customer’s requirements