蓝宝石LED衬底通过PSS加工后,会改善蓝宝石LED衬底的缺陷,由外延芯片封装出来的LED发光源能大大提高其发光效率
晶片参数
Item | 2" | 4"(研发中) |
Crystal | LED Grade Sapphire | LED Grade Sapphire |
Sapphire purity | ≥99.998% | ≥99.998% |
Color | Transparent | Transparent |
Orientation | C plane tiled M axis 0.20°±0.1° | C plane tiled M axis 0.20°±0.1° |
Diameter | 50.8±0.1mm | 100±0.2mm |
Diameter | 50.8±0.1mm | 100±0.2mm |
Thickness | 430±15µm | 650±25µm |
Primary Flat Location | A-axis ± 0.2° | A-axis ± 0.2° |
Flat Length | 16.0±1.0 mm | 30.0 ±1.0 mm |
Front side surface | Epi-ready patterned surface | Epi-ready patterned surface |
Back side surface | Fine ground; Ra < 1.2 um | Fine ground; Ra < 1.2 um |
TTV | ≤ 5.0µm | ≤ 10µm |
BOW | ≤ -10µm | ≤ -20µm |
Pattern diameter | 2.6±0.15 um | 2.6±0.15 um |
Pattern height | 1.6±0.15 um | 1.6±0.15 um |
Pattern pitch | 3.0±0.15 um | 3.0±0.15 um |
Pattern arrangement | Close-packed arrangement; hexagonal type | Close-packed arrangement; hexagonal type |
Defective patterns | Total defective area ≦3% of wafer area; Inspection by naked eye added without bright light | Total defective area ≦5% of wafer area; Inspection by naked eye added without bright light |
Scratch | Visible to naked eye added without bright light; total length < 3mm | Visible to naked eye added without bright light; total length < 5mm |
Package | Clean room, vacuum packing | Clean room, vacuum packing |